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LED顯示屏封裝技術你知道多少?

發表于:2022-07-14 11:47:00 來源:http://www.rb8707.com/news837998.html

LED顯示有哪些封裝技術

1、表貼(SMD)

表貼(SMD)封裝是將單個或多個LED芯片焊在帶有塑膠“杯形” 外框的金屬支架上(支架外引腳分別連接LED芯片的P、N級),在往塑膠外框內灌封液態環氧樹脂或者有機硅膠,然后高溫烘烤成型,然后切割分離成單個表貼封裝器件。

2、全新的集成封裝技術IMD(四合一)

LED顯示屏企業對SMD貼裝工藝有著很深厚的技術積淀,而“四合一”封裝是對SMD封裝繼承的基礎上做出的進一步發展。SMD封裝一個封裝結構中包含一個像素,而“四合一”封裝一個封裝結構中包含四個像素。雖然四合一LED顯示屏采用的是全新的集成封裝技術IMD(四合一)其工藝上依然沿用的是表貼工藝。

“四合一”Mini LED模組IMD封裝集合了SMD和 COB的優點,解決了墨色一致性、拼接縫、漏光、維修等問題,具有高對比度,高集成,易維護,低成本等特點,它是通往更小間距道路上比較好的折中方案。當前,“四合一”Mini LED模組出于成本的考慮,采用的是正裝的芯片,隨著封裝廠商對芯片做出更多的要求,將會進一步推出“六合一”甚至“N合一”方案。

3、COB封裝技術

COB封裝是一種將裸芯片用導電或非導電膠粘附在互連基板上,然后進行引線鍵合實現其電器連接。COB封裝采用的是集成封裝技術,由于省去了單顆LED器件,封裝后再貼片工藝。能夠有效解決SMD封裝顯示屏,因為點間距不斷縮小,面臨的工藝難度增大、良率降低成本增高等問題,COB更易于實現小間距。

相關標簽:LED顯示屏,

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